Patterning from the Layer Side, even on Thinnest Glass

4JET’s answer to layer side patterning applications, especially on thin and hard to handle glass sheets or flexible substrates – the TOPAZ LS! The LS systems have been designed as reliable 24/7, high performance, high resolution, high accuracy inline laser systems for the patterning of functional coatings on substrates from the layer side (LS), whether the application is technical, architectural or transportation glass.

Granite for long-term stability and accuracy

Our TOPAZ LS is based on a gantry structure in which the x-axis bridge is stationary and firmly connected to the machine bed. A substrate table is moved back and forth by the y-axis. This system design has the advantage of shorter beam paths for a stable and therefore accurate beam position on the substrate. The gantry configuration is always preferred when the laser cannot be moved due to its size and/or weight. In addition, the substrate can be fixed on the table, which also provides a stable and uniform surface for laser structuring, even on the thinnest glass substrates. The table can be switched from fixing into transporting mode to allow the substrate to be transported in or out of the system. The gantry configuration is twice as long as the substrate in transport direction.

The Heart of the TOPAZ LS

Depending on the required pattern resolution and the cycle time requirements the patterning axis can be equipped with multiple scanners, operating in the scanning-on-the-fly mode which increases the machine’s throughput and reduces production costs.

The laser wavelength and pulse length and thus the laser source is chosen according to the specific requirements of the application for best product quality and taking into account economical aspects. Additional optional features like e.g. the TOPAZ DYNAMIC FOCUS provide additional means to achieve an optimal product quality, in case the incoming glass substrate deviates from the flat shape.


Thin-filmstransparent conductive oxides (ITO, SnO2, ZnO, FTO), Silver coating systems, Molybdenum, PV-absorber, etc.
Laser wavelengthsNIR, VIS, UV
Laser pulse lengthsfemto-, pico- or nanoseconds
Patterning resolution15 µm to 100 µm (depending on wavelength and optical configuration)
Processingablative patterning from the film side
Scanning on-the-flyoptional, 2D-scanning head based 
number of processing headsmultiple (depending on tact time requirements)
Working area (x, y)M: 1.200 x 800 mm² / L: 1.500 / XL: 2.200 x 3.050 mm² (length is scalable)
Substrate dimensionscustomer specific within machine working area specification
glass thickness30 µm up to 6 mm
Axis speedup to 2 m/s 
Position Accuracy 
@temperature range 22 ± 2C°
+/- 15 µm
+/- 20 µm relative to fiducial system (TOPAZ FIDUCIAL REQUIRED)
Particle extraction high volume flow at medium pressure
standard equipped with fine filter and H13 filter package, self-cleaning fine filters, dust collection in barrel
MES interfaceoptional
Footprint depending on working area
Weightdepending on machine size
Loading and unloadingmanual or automatic
Additional featuresTOPAZ DYNAMIC FOCUS


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