PEARL 400S – Compact Wafer Processing

The PEARL 400S is a modular laser processing platform for glass wafers, glass substrates for the semiconductor industry, and other brittle materials.

It is ideal for applications in microelectronics, optics, sensing, and AR technology – anywhere where the highest precision, process reliability, and cleanroom compatibility are required.

The platform is built on a highly stable granite gantry and is available in various configurations – each optimized for specific process steps such as nanoPerforation (Wafer Dicing, WD), thermal separation (WS), ablation, or microdrilling (Wafer Ablation, WA).

Applications for the PEARL 400S

Glass Wafers for MEMS and Sensing

Processing glass wafers for micro-electromechanical systems (MEMS), pressure sensors, accelerometers, and other sensing technologies.
Micro-Optics & Wafer Level Optics (WLO)

Structuring and singulation of micro-optical components at wafer level, including stacked wafers for complex optical systems.
Macro- and Micro-Optics/Molded Optics

Precision processing of optical components in various sizes, including molded optics for industrial and medical applications.
Meta-Surfaces for AR & Wearables

Structuring glass for advanced optical functions, for example AR glasses, head-up displays, and wearable devices.
Rotary & Linear Encoders

High-precision structuring and singulation of glass and silicon components for position and motion sensing in automation.
Research & Development/Prototyping

Precision drilling, structuring, and dicing for R&D projects, prototyping, and small series – adaptable to new materials and designs.
Dicing of SiC and Glass

High-precision dicing of silicon carbide, hardened and non-hardened glass – even with challenging geometries and coatings.
Dies with Coatings & Microstructures

Processing individual chips (dies) with functional layers, microstructures, or sensitive surfaces – without damage.
Color Filter and Filter Technologies

Structuring and dicing of color filters and optical coatings for cameras, sensors, and display technologies.
Glass in Semiconductor Applications

Processing glass as a carrier material or optical interface in modern semiconductor applications (e.g., Co-Packaged Optics).
Bio and medical technology
- Next Generation Sequencing (NGS): Structuring glass for DNA analysis platforms.
- Lab-on-a-chip & microfluidics: Production of microfluidic channels and structures on glass.
- DNA drug discovery: glass structures for drug discovery and screening.
- Microscopy accessories: Slide glasses and cover glasses – also with biofilms or functional coatings.
- Cuvettes & Flow Cells: Precise glass processing for optical measuring cells and flow chambers.

Interior view into a PEARL 400S. You see a precise laser drilling process. — Laser drilling process in a PEARL 400S

Highlights of the PEARL 400S Platform

Compact footprint – ideal for cleanrooms and integrated production lines.

High standardization – with preconfigured options and modules for easy expansion.

Cost efficiency – by using a single laser system with a clear process focus.

Modular wafer handler – flexibly retrofittable: from manual loading to fully automatic line integration.

Scalable automation – Depending on the application, one handler can also serve two PEARL 400S machines, or two handlers can serve one PEARL 400S for high process throughput.

Future-proof investment – start with a single PEARL 400S, expand later with wafer handlers and additional machines to increase throughput.

Flexible integration – suitable for stand-alone systems, isolated solutions, or cluster concepts with multiple machines.

Maximum process security & quality – clean, stress-free cuts and precise microstructuring.

Various Configurations Are Possible

Graphical representation of the PEARL 400S with manual loading. — PEARL 400S with manual loading – ideal for R&D

Graphical representation of the PEARL 400S with wafer handler. — PEARL 400S with wafer handler – ideal for R&D and production

Graphical representation of two PEARL 400S with wafer handler. — Two PEARL 400S with wafer handler – ideal for HVM where the laser process is slower than the loading/unloading process or where two different laser processes are required

Graphical representation of the PEARL 400S with two wafer handlers. — PEARL 400S with two wafer handler – ideal for HVM where the laser process is faster than the loading/unloading process

PEARL 400S WD – Laser Dicing for Glass Wafers

The WD version (Wafer Dicing) is designed for laser cutting of glass wafers and brittle materials, performing the first stage – nanoPerforation – to prepare the substrate for separation.

The separation process in two steps:

1. nanoPerforation

A picosecond laser creates a series of microscopic modifications in the glass volume along the desired separation contour.

2. Separation

Takes place in a separate process step, either:

Thermally with the PEARL 400S WS, or
Mechanically with the DTX 200 NX, a high-precision breaking system.

Learn more about DTX 200 NX

Whether small dies or large optics and eyepieces – the WD version covers a wide range of applications. Mechanical separation is the better choice for very small components (< 3 mm), sensitive functional layers that could be damaged by the heat-affected zone of a CO₂ laser, or materials with low thermal expansion coefficients (e.g., lithium niobate, quartz glass). In all other cases, thermal separation can be used.

Interior view into a PEARL 400S. You see a precise nanoPerforation process. — NanoPerforation process in a PEARL 400S

Advantages of the PEARL 400S WD

Precise nanoPerforation as preparation for separation – enables both thermal and mechanical breaking.

Efficient process balancing – optimized throughput by separating nanoPerforation (WD) and separation (WS or DTX 200 NX).

Cost advantage when scaling – for example, by combining a WD with several cost-effective WS systems.

Extremely low breakage and high edge strength.

Dry, low-particle process – ideal for clean rooms.

Wafer sizes up to 300 mm including film frame or panels with edge lengths up to 400 mm.

Special tool holders for thin glass or film frames are available.

Perfect for MEMS, AR optics, encoder discs, semiconductor housings, and ultra-thin glass.

Two variants for maximum flexibility

We offer two variants of our patented nanoPerforation process:

nanoPerforation (nP)

the standard solution for precise, clean cuts with high process reliability.

Enhanced nanoPerforation (EnP)

with even higher edge strength, reduced chipping, and greater geometric flexibility – ideal for complex cutting patterns and industrial high-throughput applications.

Detailed information on the technology and areas of application can be found on our application page for laser glass cutting.

Learn more about Laser Cutting

PEARL 400S WA – Laser Ablation & Microprocessing for glass and brittle materials

The WA version (Wafer Ablation) is built for laser ablation, microdrilling, and surface structuring –contactless, stress-free, and with minimal heat-affected zones. It works with glass, silicon carbide (SiC), and coated substrates.

Typical applications:

Laser glass drilling

Precise micro-drilling with minimal chipping and high edge quality.

Microstructuring

For meta-surfaces, optical components, and microfluidic systems.

Surface processing

For functionalization or preparation for further process steps, for example.

Processing of thin and sensitive glass

Even below 100 µm, without mechanical stress.

Detailed information on glass processing by drilling and structuring can be found on our application page for laser drilling.

Learn more about Laser Drilling

Advantages:

Minimal heat-affected zone (HAZ) – ideal for sensitive materials

High processing speed – even with demanding substrates such as SiC

Flexible drilling geometry – chamfers possible at hole inlets and outlets

Flexible laser integration – nano, pico or femtosecond lasers available depending on requirements

Modular wafer handler – can be retrofitted for automation and increased throughput

Cleanroom-compatible and compact – ideal for integrated production environments

Scalable – from single machine to cluster solution with multiple PEARL systems

Common technical data (WD & WA)

Category	Feature	Specification
System Size & Weight	Dimensions (W × D × H)	1400 × 1865 × 2380 mm
	Weight	~ 2,800 kg
Axes & Motion	Processing Area	400 × 400 mm 600 × 600 mm
	Feed Rate	Up to 1000 mm/s
	Acceleration	10 m/s²
	Pattern Accuracy*	< 2.5 µm + 10 × 10⁻⁶ × L
	Repeatability	≤ 1 µm
	Pattern Placement Accuracy	10 µm
Software & Operation	HMI	Touchscreen-based user interface
	CAD Post-Processor	DXF import, easy job configuration
	cVision	Fiducial and glass edge recognition
	MES SECS/GEM (optional)	Manufacturing execution system integration
Automation	Wafer Handler	Fully automated wafer handler for two cassettes
	Wafer ID Reader	Automatic wafer ID reading